JPH0128670Y2 - - Google Patents
Info
- Publication number
- JPH0128670Y2 JPH0128670Y2 JP1393982U JP1393982U JPH0128670Y2 JP H0128670 Y2 JPH0128670 Y2 JP H0128670Y2 JP 1393982 U JP1393982 U JP 1393982U JP 1393982 U JP1393982 U JP 1393982U JP H0128670 Y2 JPH0128670 Y2 JP H0128670Y2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- support plates
- support plate
- long support
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 description 18
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Prevention Of Fouling (AREA)
- Electrodes Of Semiconductors (AREA)
- Weting (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1393982U JPS58116226U (ja) | 1982-02-03 | 1982-02-03 | 半導体装置の製造装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1393982U JPS58116226U (ja) | 1982-02-03 | 1982-02-03 | 半導体装置の製造装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58116226U JPS58116226U (ja) | 1983-08-08 |
JPH0128670Y2 true JPH0128670Y2 (en]) | 1989-08-31 |
Family
ID=30026424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1393982U Granted JPS58116226U (ja) | 1982-02-03 | 1982-02-03 | 半導体装置の製造装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58116226U (en]) |
-
1982
- 1982-02-03 JP JP1393982U patent/JPS58116226U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS58116226U (ja) | 1983-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0128670Y2 (en]) | ||
JP3376875B2 (ja) | 導電性ボールの移載装置および移載方法 | |
JPS6461027A (en) | Device for mounting chip | |
CN216710880U (zh) | 一种集成式上下料装置 | |
TW511202B (en) | Inner lead bonding apparatus | |
CN115592045A (zh) | 一种轴向二极管的管脚立式引直加工机构 | |
JP3151695B2 (ja) | 外部リードボンデイング方法及び装置 | |
JP3132305B2 (ja) | 半田ボールの搭載装置 | |
JP2566734Y2 (ja) | 搬送ハンド | |
CN210336729U (zh) | 一种用于半导体封装加工模具 | |
CN210452769U (zh) | 一种蚀刻夹爪作业装置 | |
JPS5838609Y2 (ja) | ボンディング装置 | |
JPH0241913Y2 (en]) | ||
JPS6362331A (ja) | 半導体樹脂封止装置 | |
CN211332316U (zh) | 泵体加工治具 | |
JPS6215891A (ja) | 電子部品移載装置 | |
JPH04350950A (ja) | チップの位置決め装置 | |
JP3522131B2 (ja) | 産業ロボット装置 | |
JPS5933975B2 (ja) | 半導体搭載装置 | |
CN109605211A (zh) | 一种晶圆抛光交换系统及方法 | |
JPS6074808U (ja) | プレス用型具 | |
KR20000041715A (ko) | 도금 장치의 리드프레임 공급부 | |
JPH0810188Y2 (ja) | ボンディング装置 | |
JPH0344386Y2 (en]) | ||
JP2002346906A (ja) | 切断装置 |